Help me to translate this technical specification [复制链接]

I downloaded a technical document from the forum, but this passage below is really beyond me. Do you mind helping me to translate these words? Your kind help would be appreciated.

Drying (baking) moisture sensitive devices

The components that typically are moisture sensitive are all PWBs having microvias on pads or having Aramid fibre reinforcement, most QFP components with lead count higher than 50, all CSP components regardless of ball count, most optical devices based on acrylic plastics (IR modules, all LEDs), special plastic integrates structures (plastic power devices including polyimide tape or equivalent interfaces).

The purpose of NMP baking is to decrease amount of water from plastic packages prior soldering. As absorbed water vaporise in reflow, internal cracks and failures may be created.

Note standards and instructions for moisture sensitive components regarding protective packing in shipping and storage together with this specification.

Moisture sensitive component unprotected exposure time in ambient    Preventative action required
More than 48, but less than 168 hours,
In case JEDEC class 5a or 6, more than 24 h    bake condition: 12 (+10,-2)h @60 5C, RH 5%
More than 168 hours    bake condition: 168h@605C, RH 5%

Note! Prevent direct contact of reels to drying chamber side and bottom walls, since these may be at significantly higher temperature than oven controller indicates. Verify feasibility of drying oven to component moisture removal and effect of various loading conditions by careful study of oven temperature control system.

适度敏感元器件的烘干

典型的适度敏感元器件包括 焊盘间有细小通孔或是有人造纤维加强的所有线路板；绝大多数引脚数超过50的QFP元件；所有的CSP元件（无论其植球数多少）；大多数基于丙烯酸塑料的光学器件（红外模组，所有发光二极管）；专用的塑料集成结构（塑料电源装置包括聚酰亚胺胶带或等同材质）

NMP烘烤的目的在于减少焊接前塑料封装内的水分，因为当被吸收的水分在回流焊内汽化时，可能会导致元器件内部开裂或是失效。

请同时注意本规范与温适度敏感元器件有关运输和储存过程中的保护性包装的标准和指示.

baking process and conditions ... 此段较为简单，略去译文。

注：避免待烘烤元件与烘箱侧壁及底部的直接接触，因为这些位置的实际温度可能会远远高于温控仪所示温度，仔细研究烘箱温控系统，以确认用烘箱去处元器件湿气的可行性和不同放置条件下的效果。

以上翻译仅供参考，受制于本人对产品，制程，以及上下文的理解，或许未能准确表述原文意图，望见谅。
or should i put these words in English? hehe

Drying (baking) moisture sensitive devices
干燥（烘烤）湿度敏感器件

The components that typically are moisture sensitive are all PWBs having microvias on pads or having Aramid fibre reinforcement, most QFP components with lead count higher than 50, all CSP components regardless of ball count, most optical devices based on acrylic plastics (IR modules, all LEDs), special plastic integrates structures (plastic power devices including polyimide tape or equivalent interfaces).
组成部分的元件，通常是水分敏感都有PWBs微通道上垫或芳纶纤维加固，大多数的QFP组件导致计铅数高于50 ，所有CSP的组成部分，不论球计数，大多数光学设备的基础上有机玻璃（红外模块，所有发光二极管） ，特殊塑料集成结构（塑料功率器件，包括聚酰亚胺胶带或同等学历接口） 。

The purpose of NMP baking is to decrease amount of water from plastic packages prior soldering. As absorbed water vaporise in reflow, internal cracks and failures may be created.
NMP的目的是为了减少烘烤的水量从塑料包装事先焊。由于水蒸发吸收的回流，可能会产生内部裂纹和失败。

Note standards and instructions for moisture sensitive components regarding protective packing in shipping and storage together with this specification.
注意标准和指示，湿度敏感元件中关于保护包装运输和存储结合本规范。

Moisture sensitive component unprotected exposure time in ambient   Preventative action required:
注意标准和指示，湿度湿度敏感元件保护的环境中暴露时间预防需要采取的行动：

More than 48, but less than 168 hours,
超过48 ，但小于168小时

In case JEDEC class 5a or 6, more than 24 h
如果在JEDEC的5A或6级，超过24小时

bake condition: 12 (+10,-2)h
烘烤条件： 12 （ +10 / -2 ）小时
@605C, RH 5%
在605度摄氏，相对湿度： 5 ％

More than 168 hours
超过168小时

bake condition: 168h@605C, RH 5%
烘烤条件： 168小时 在605度摄氏，相对湿度： 5 ％


Note! Prevent direct contact of reels to drying chamber side and bottom walls, since these may be at significantly higher temperature than oven controller indicates. Verify feasibility of drying oven to component moisture removal and effect of various loading conditions by careful study of oven temperature control system.
注意！防止直接接触的卷筒到干燥室和底部一侧墙壁，因为这些可能会显着较高的温度比烤箱控制器显示。验证可行性干燥箱，以去除部分水分和不同工况的仔细研究烤箱温度控制系统。

注意！ 请确认这个数目 "@ 60  5  ç"