I downloaded a technical document from the forum, but this passage below is really beyond me. Do you mind helping me to translate these words? Your kind help would be appreciated.
Drying (baking) moisture sensitive devices
The components that typically are moisture sensitive are all PWBs having microvias on pads or having Aramid fibre reinforcement, most QFP components with lead count higher than 50, all CSP components regardless of ball count, most optical devices based on acrylic plastics (IR modules, all LEDs), special plastic integrates structures (plastic power devices including polyimide tape or equivalent interfaces).
The purpose of NMP baking is to decrease amount of water from plastic packages prior soldering. As absorbed water vaporise in reflow, internal cracks and failures may be created.
Note standards and instructions for moisture sensitive components regarding protective packing in shipping and storage together with this specification.
Moisture sensitive component unprotected exposure time in ambient Preventative action required
More than 48, but less than 168 hours,
In case JEDEC class 5a or 6, more than 24 h bake condition: 12 (+10,-2)h @60 5C, RH 5%
More than 168 hours bake condition: 168h@605C, RH 5%
Note! Prevent direct contact of reels to drying chamber side and bottom walls, since these may be at significantly higher temperature than oven controller indicates. Verify feasibility of drying oven to component moisture removal and effect of various loading conditions by careful study of oven temperature control system.